Taiwan Semiconductor Manufacturing Company (TSMC) is joining with Intel and Samsung to define new industry standards for the next frontier in semiconductors: advanced chip-packaging technologies.
The three companies communicated that they will form a new consortium along with Qualcomm, Arm, Meta, Microsoft, and several other industry players.
Aim of the consortium
- The aim is to set standards for packaging and stacking, the final steps in the chipmaking process.
- The development reflects the growing importance of chip packaging as chipmakers strive to gain the upper hand in the competitive industry.
- This will aid collaboration across the packaging and stacking ecosystem. (TSMC) is joining with Intel and Samsung to define new industry standards for the next frontier in semiconductors:
- The new consortium aims to establish a single chip packaging standard, dubbed Universal Chiplet Interconnect Express (UCIe), to create a new ecosystem and fuel collaboration in the packaging and stacking segments. Better ways of combining different types of chips — or so-called chiplets — in one package can create a more powerful chip system.
There are limits to the number of transistors that can be fit on a chip, so firms are now trying to optimize their products’ performance by packing and stacking chips in various combinations instead.
This initiative will be a very big one for strengthening the ecosystem of chip manufacturing in the world and we do look forward for such consortiums in the near future as well.
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