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    Home»Tech»Featured»TSMC joins with Intel & Samsung for advanced chip packaging technologies
    Featured

    TSMC joins with Intel & Samsung for advanced chip packaging technologies

    MOBILITY INDIABy MOBILITY INDIAMarch 5, 2022Updated:March 5, 2022No Comments2 Mins Read
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    Taiwan Semiconductor Manufacturing Company (TSMC) is joining with Intel and Samsung to define new industry standards for the next frontier in semiconductors: advanced chip-packaging technologies.

    The three companies communicated that they will form a new consortium along with Qualcomm, Arm, Meta, Microsoft, and several other industry players.

    Aim of the consortium

    • The aim is to set standards for packaging and stacking, the final steps in the chipmaking process.
    • The development reflects the growing importance of chip packaging as chipmakers strive to gain the upper hand in the competitive industry.
    • This will aid collaboration across the packaging and stacking ecosystem. (TSMC) is joining with Intel and Samsung to define new industry standards for the next frontier in semiconductors:
    • The new consortium aims to establish a single chip packaging standard, dubbed Universal Chiplet Interconnect Express (UCIe), to create a new ecosystem and fuel collaboration in the packaging and stacking segments. Better ways of combining different types of chips — or so-called chiplets — in one package can create a more powerful chip system.

    There are limits to the number of transistors that can be fit on a chip, so firms are now trying to optimize their products’ performance by packing and stacking chips in various combinations instead.

    This initiative will be a very big one for strengthening the ecosystem of chip manufacturing in the world and we do look forward for such consortiums in the near future as well.

    If you have an interesting Article / Report/case study to share, please get in touch with us at editors@roymediative.com/ roy@roymediative.com , 9811346846/9625243429.

    Arm chip packaging technologies Intel & Samsung Meta Microsoft new consortium TSMC
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    MOBILITY INDIA Bureau: If you have an interesting article/experience/case study related to the ICT industry to share, please send us at editors@roymediative.com

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