MediaTek’s Dimensity 1000C delivers premium 5G experiences, advance AI capabilities, enhanced display features and ultra-fast connectivity
MediaTek has announced its newest 5G smartphone chip, the Dimensity 1000C, which debuted first in the United States. The Dimensity 1000C will power LG’s newest device, the LG VELVETTM on T-Mobile’s nationwide 5G network, and deliver advance AI capabilities, enhanced display features, fast connectivity and improved multimedia capabilities for a premium user experience.
“From the world’s first standalone 5G data call to collaborating on their first 5G chipset in America, T-Mobile and MediaTek have partnered to move 5G innovation forward,” said Ryan Sullivan, VP of Product Development at T-Mobile. “This is another step towards #5GforAll on America’s largest nationwide 5G network.”
The 7nm Dimensity 1000C features super fast 5G speeds and expands MediaTek’s 5G family of chipsets and its flagship series that delivers full premium 5G experiences for smartphone users.
“Compared to other parts of the world, consumers in the U.S. haven’t had much choice on the chipset side when it comes to 5G smartphones,” said Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business Unit. “MediaTek is focused on giving consumers more options and expanding access to 5G devices so that everyone can enjoy the premium features and speeds that are defining the next era of mobile computing.”
The Dimensity 1000C features four Arm-Cortex-A77 CPU cores and four power-efficient Arm Cortex-A55 cores operating up to 2GHz, with a large, low-latency communal cache that improves performance and power-efficiency even further. Five Arm Mali-G57 GPU cores mean avid gamers have powerful graphics at their fingertips. The MediaTek AI processing unit (APU 3.0) combines three different types of AI processors. This versatile and unique design meets the needs of the latest AI-camera, AI-assistant, in-app and OS-enhancements for superior smartphone experiences.
